Component placement device

ABSTRACT

A component placement device includes: (a) an elongated transport device by means of which substrates to be provided with components can be moved in a transport direction parallel to the transport device; (b) at least one component feeder that is located along a longitudinal side of the transport device; (c) at least one component pick-and-place unit by means of which in operation a component can be picked-up from the component feeder and placed on a substrate; and (d) a substrate support, which is located along a longitudinal side of the transport device opposite to the component feeder.

The invention relates to a component placement device comprising anelongated transport device by means of which transport device inoperation substrates to be provided with components can be moved in atransport direction parallel to the transport device, which componentplacement device further comprises at least one component feeder whichis located along a longitudinal side of the transport device, as well asa component pick and place unit by means of which in operation acomponent can be picked up from the component feeder and placed on asubstrate.

In such a component placement device known from international patentapplication WO 95/19099 component feeders are arranged on either one ofthe two longitudinal sides of the transport device.

By means of pick-and-place units components are picked up from thecomponent feeders and placed on the substrates supported by thetransport device.

The size of the substrate in a direction transverse to the transportdirection depends, among other things, on the distance between thefeeders located on either one of the two sides of the transport device.In order to keep the distance between the component feeders and thesubstrate shortest possible, the component feeders are preferablyarranged as close to the transport device as possible. The size of thesubstrates which can be provided with components by the known devices issuch that on the one hand a great variety of substrates can be providedwith components by the same component placement device, whereas at thesame time the distance between the component feeders and the substratesis shortest possible. In practice this means that relatively largesubstrates, a dimension of which in a direction extending transverselyto the transport direction is relatively large, cannot be provided withcomponents by means of the component placement devices known per se.Such substrates are then to be provided with components either by handor a special component placement device is to be procured. The distancebetween the component feeders and the substrate is then relativelylarge. In addition, such a specific component placement device isrelatively expensive, takes up relatively much room and will be appliedin relatively few cases at that.

Therefore, it is an object of the invention to provide a componentplacement device which is suitable in a relatively simple manner forcomponents to be placed on relatively large substrates while at the sametime components can efficiently be placed on customary substrates.

This object is achieved with the component placement device according tothe invention in that the component placement device further comprises asubstrate support situated along a longitudinal side of the transportdevice, which side faces away from the component feeder.

By means of the substrate support relatively large substrates can besupported on a side facing away from the component feeder. By means ofthe component pick-and-place unit or units, components are picked upfrom the component feeder and moved over the transport device to thesubstrate supported by the substrate support.

The substrates having relatively small, normal or customary sizes aremoved through the component placement device in customary fashion bymeans of the transport device and provided with components by means ofthe pick-and-place unit.

The time required for placing the components on the customary substrateswill not be affected or hardly be affected by the addition of thesubstrate support, while the substrate support is instrumental inproviding the possibility to mount components on relatively largesubstrates in an efficient manner by means of an already availablecomponent placement device.

An embodiment of the component placement device according to theinvention is characterized in that the substrate supports are detachablyconnected to the component placement device.

If the substrate support is detachably connected to the componentplacement device it is possible to remove the substrate support themoment when only customary substrates are to be provided withcomponents. It is then possible for movable component feeders to beadded to the component placement device once the substrate support hasbeen removed, so that the number of different components that can bepositioned on the substrate transported by means of the transport deviceis increased and also the speed at which the components can be mountedon the substrates is increased.

Another embodiment of the component placement device according to theinvention is characterized in that the substrate support comprisesdriving means by which in operation a substrate can be moved in afeeding direction extending transversely to the transport direction.

A substrate supported by the substrate support can easily be moved inthe transport direction by the driving means so that the substrate islocated closest possible to the component placement device(s) located onthe other side of the transport device at the time when components fromthe component placement devices are mounted on the substrate by means ofthe component pick-and-place unit.

Yet another embodiment of the component placement device according tothe invention is characterized in that the transport device comprises atleast one guide profile extending parallel to the transport direction,which profile is connected to the substrate support, the guide profiletogether with the substrate support being movable in a directionextending transversely to the transport direction.

In this manner it is possible to move the guide profile of the transportdevice in the direction of the component placement device, so that thewidth occupied by the transport device is limited. Moreover, at the sametime the substrate support connected to the guide profile is also movedin the direction of the component feeder, so that the distance betweenthe component feeder and the substrate support is diminished.

Yet another embodiment of the component placement device according tothe invention is characterized in that the substrate support comprisestwo parallel guides which extend transversely to the transportdirection.

By means of such guides it is possible in a simple manner to move asubstrate to and from the component feeders and also to efficientlysupport a substrate.

If the distance between the guides is adjustable, the substrate supportcan be simply adapted to substrates of different sizes.

Yet another embodiment of the component placement device according tothe invention is characterized in that the substrate support can bemoved vertically from a position situated parallel to the transportdevice to a position underneath the transport device.

As a result of the vertically movable substrate support it is possiblein a simple way to move the substrate support between a position inwhich the substrate support is situated parallel to the transportdevice, so that a substrate on which components can be mounted can besupported by the substrate support. The substrate support is furthermovable to a position underneath the transport device, where thesubstrate support is unfit for supporting substrates but where the roomabove the substrate support is accessible for, for example, additionalcomponent feeders.

These and other aspects of the invention are apparent from and will beelucidated with reference to the embodiments described hereinafter.

In the drawings:

FIG. 1 shows a state of the art plan view of a component placementdevice,

FIG. 2 shows a plan view of a first embodiment of a component placementdevice according to the invention,

FIG. 3 shows a plan view of a second embodiment of a component placementdevice according to the invention,

FIG. 4 shows a plan view of a third embodiment of a component placementdevice according to the invention,

FIGS. 5A and 5B show plan views of a fourth embodiment of a componentplacement device comprising component feeders positioned between asubstrate support and a substrate supported by the substrate support,

FIG. 6 shows a plan view of a further embodiment of a componentplacement device according to the invention,

FIGS. 7A-7D show plan views of a substrate support and various drivingmeans therefor, respectively.

Corresponding components in the drawing Figures carry like referencenumerals.

FIG. 1 shows a state of the art component placement device 1 whichcomprises a frame 2, a transport device 3 supported by the frame 2, abeam 4 supported by the frame 2 and movable in and opposite to thedirection indicated by the arrow Y as well as rows of component feeders5 supported by the frame 2 and positioned along either one of the twosides of the transport device 3. The beam 4 supports a slide 6 whichcomprises a number of component pick-and-place units 7 which are movablerelative to the beam 4 in and opposite to the direction indicated by thearrow X by means of the slide 6.

The transport device 3 comprises two guide profiles 8 extending inparallel to each other.

The operation of the state of the art component placement device 1 is asfollows. A substrate 9 is supported by the guide profiles 8 andtransported by the transport device 3 in the direction indicated by thearrow X through the component placement device 1. The componentpick-and-place units 7 are moved in and opposite to the directionindicated by arrow X and also in and opposite to the direction indicatedby the arrow Y between the various component feeders where componentsare picked up from the component feeders 5 by means of the componentpick-and-place units 7. Subsequently, the component pick-and-place units7 are consecutively taken to the desired positions on the substrate 9where the components are mounted on the substrate 9 by means of thecomponent pick-and-place units 7.

The maximum size B of the substrate 9 is determined by the maximummutual distance between the guide profiles 8 of the transport device 3.

Consequently, substrates 9 having a size B which is, for example, twiceor three times as large as the size shown in FIG. 1, cannot be providedwith components by the transport device 3.

FIG. 2 shows a plan view of a first embodiment of a component placementdevice 11 according to the invention which largely corresponds to thedevice 1 shown in FIG. 1. The component placement device 11, however,has only one row of component feeders 5 on one side of the transportdevice 1. On a side of the transport device 3 facing away from thecomponent feeders 5 the component placement device 11 comprises twoguides 12 extending transversely to the transport device and indicatedby the arrow X to support a relatively large substrate 13. Componentsare placed on the substrate 13 in a comparable manner to the componentplacement device 1 shown in FIG. 1. The area of the substrate 13 whichcan accommodate components is limited by the maximum displacement of theslide 6 in the direction opposite to the arrow Y relative to the frame2. If the substrate area 14 situated as it were outside the componentplacement device 11 is also to be provided with components, thesubstrate 13 is to be turned around after it has partially been providedwith components, after which the area 14 ends up close to the guideprofiles 8.

The guides 12 forming the substrate support 15 can permanently beconnected to the guide profiles 8, in which case the component placementdevice 11 is directly available for placing components on relativelylarge substrates 13. The distance between the guides 12 is preferablyadjustable, so that substrates 13 of different sizes 11 can be simplysupported by the guides 12. As is apparent from FIG. 2, the guideprofile 8 situated close to the guides 12 has been moved relativelyclose to the other guide profile 8 of the transport device 3. As aresult, the distance between the component feeders 5 and the substrate13 is relatively small.

If components are to be placed on a relatively small substrate 8 bymeans of the component placement device 11, the guide profiles 8 arebrought to such a mutual distance that the substrate 8 to be providedwith components can be supported by the guide profiles 8, after whichthe substrate is transported by the component placement device 11 in thetransport direction indicated by the arrow X in a similar manner to theone explained with reference to FIG. 1, in which components are pickedup from the component feeders 5 and placed on the substrate by means ofthe component pick-and-place units 7.

If the guides 12 continue to be connected to the guide profile 8, onlycomponent feeders 5 can be used which are located on a side of thetransport device 3 facing away from the guides 12. However, if theguides 12 are detachably connected to the component placement device,once the guides 12 have been removed, removable or movable componentfeeders 5 can be placed in the space falling vacant as a result of theremoved guides 12, so that the component placement device 11 canfunction in a similar manner to the component placement device 1 shownin FIG. 1.

FIG. 3 shows another embodiment of a component placement device 21according to the invention, which is distinguished from the componentplacement device 11 shown in FIG. 2 in that the guide profile 8 facingaway from the component feeders 5 comprises a coupling strip 22 that hassupports 23, 24 near either one of the two ends. The support 24 can bemoved along the coupling strip 22 in the directions indicated by thedouble arrow P1, so that the mutual distance between the supports 23 and24 can be simply adjusted. The supports 23, 24 are used for supportingthe guides 12 which extend transversely to the guide profile 8 and thecoupling strip 22 connected to it. On a side facing away from the guideprofile 8, further supports 25, 26 are provided to render additionalsupport to the guides 12 and the substrates 13 to be supported by theguides 12. The coupling strip 22, the supports 23-26 and the guides 12together form a substrate support.

A substrate 13 is moved in the direction indicated by the arrow P2,supported by the guides 12 to the component feeders 5 either manually orby means of a substrate feeder until a head end of the substrate 13abuts the coupling strip 22. Subsequently, components from the componentfeeders 5 are placed on the substrate 13 in a similar manner to the oneexplained with reference to the component placement device 11 shown inFIG. 2.

FIG. 4 shows a further embodiment of a component placement device 31according to the invention, which largely corresponds to the componentplacement device 11 shown in FIG. 2. The component placement device 31distinguishes itself from the component placement device 11 in that on aside facing away from the component feeder 5 there is a movablesubstrate support on wheels 32 which has an undercarriage on wheels 33and a substrate holder 34 supported by the carriage 33. Components canbe placed on the substrate 13 by means of the component pick-and-placeunits 7 in a similar manner to the one that is explained with referenceto FIG. 2. Preferably, stops are provided in the component placementdevice 31 against which the undercarriage on wheels 33 can be accuratelypositioned in directions X, Y and Z.

The undercarriage on wheels 33 makes it possible to provide a relativelylarge substrate 13 with components in a relatively fast manner. Once thesubstrate 13 has been provided with components, the undercarriage onwheels 33 is removed and the thus available room is preferably taken upby a detachable row of component feeders 5.

FIGS. 5A and 5B show yet another embodiment of a component placementdevice 41 according to the invention, which comprises two guides 42which form a substrate support 43 and extend transversely to the guideprofiles 8. The guides 42 each have two supports 44 relative to whichthe guides 42 can be moved in a direction Z extending transversely tothe plane of the drawing. In the position shown in FIG. 5A the guides 42are in relatively low position underneath the guide profiles 8 where theguides 42 do not cause any hindrance to the substrate 9 to betransported over the guide profiles 8.

Components are picked up from the component feeders 5 positioned oneither one of the two sides of the transport device 3 and placed on thesubstrate 9 in the manner described above by means of componentpick-and-place units 7.

If relatively large substrates 13 are desired to be provided withcomponents by means of the component placement device 41, the row ofcomponent feeders 5 positioned between the guides 42 is temporarilyremoved. Then the guide profile 8 that is located above the guides 42 ismoved in the direction of the other guide profile after which the guides42 are moved in an upward direction Z relative to the supports 44 untilthe guides 42 are situated in the same plane as the guide profiles 8.

Subsequently, a substrate 13 on which components are placed in themanner already described above is put on the guides 42. In the device 41the substrate support 43 therefore need not be removed completely, sothat also relatively large substrates 13 can be provided with componentsin a relatively fast manner.

FIG. 6 shows yet another embodiment of the component placement device 51according to the invention, which largely corresponds to the componentplacement device 21 shown in FIG. 3. The component placement device 51distinguishes itself from the component placement device 21 in thatcomponent placement device 51 comprises a substrate holder 52 on which asubstrate 13 is positioned at a location beside the component placementdevice. Subsequently, the substrate holder 52 is placed with positioningholes 53 over pins 54 protruding from the supports 23, 24. The substratesupport 52 is supported by the supports 25, 26 on a side facing awayfrom the support 23, 24.

After the substrate 13 has been inserted into the component placementdevice 51 in the manner described above, components from the componentfeeders 5 are placed on the substrate 13 by means of the componentpick-and-place units 7.

FIGS. 7A-7D show a plan view of a number of different side elevations ofa substrate support 61. The substrate support 61 comprises at least twoparallel guides 12 for supporting a substrate 13.

FIG. 7B shows a guide 12 comprising an endless conveyor belt 62 fortransporting the substrate 13 in and opposite to the direction indicatedby arrow Y.

FIG. 7C shows a guide 12 which comprises a relatively smooth supportsurface 63 over which the substrate 13 can be slid by hand in andopposite to the direction indicated by the arrow Y.

FIG. 7D shows a guide 12 comprising a strip 64 that supports an edge ofthe substrate 13, which strip has two grooves 65 extending in thedirection Y. Pins 66 are situated in the grooves 65, which pins are eachconnected to a triangular coupling face 67. On another side the couplingface 67 is hingeably connected to a coupling rod 68 an end of which isconnected to a piston 70 movable in a cylinder 69. By moving the piston70 from the position shown in FIG. 7D in a direction opposite to thearrow Y, the coupling pieces 67 will be swiveled around shafts 71 as aresult of which the strip 64 is moved in upward direction Z togetherwith the substrate 13.

The size of the relatively large substrate 13 permitting, it is quitepossible to place a single or a couple of component feeders 5 beside thesubstrate.

1.-7. (canceled)
 8. A component placement device comprising: anelongated transport device that is configured to transport a substratein a transport direction parallel to the transport device, at least onecomponent feeder that is located along a longitudinal side of thetransport device; at least one component pick-and-place unit that isconfigured to: (a) pick-up a component from the at least one componentfeeder; and (b) place the component on the substrate; and a substratesupport that is situated along a longitudinal side of the transportdevice and that faces away from the at least one component feeder. 9.The component placement device as claimed in claim 8, wherein thesubstrate support is detachably connected to the component placementdevice.
 10. The component placement device as claimed in claim 8,wherein the substrate support comprises drive means configured totransport the substrate in a feeding direction that extends transverseto the transport direction.
 11. The component placement device asclaimed in claim 8, wherein the transport device comprises at least oneguide profile that extends parallel to the transport direction, whereinthe at least one guide profile is connected to the substrate support,and wherein the at least one guide profile is configured to be movedtogether with the substrate support in a direction that extendstransverse to the transport direction.
 12. The component placementdevice as claimed in claim 10, wherein the substrate support comprisestwo guides that extend parallel to each other and transverse to thetransport direction.
 13. The component placement device as claimed inclaim 11, wherein the substrate support comprises two guides that extendparallel to each other and transverse to the transport direction. 14.The component placement device as claimed in claim 12, wherein adistance between the guides is adjustable.
 15. The component placementdevice as claimed in claim 13, wherein a distance between the guides isadjustable.
 16. The component placement device as claimed in claim 8,wherein the substrate support is configured to be moved vertically froma position parallel to the transport device to a position underneath thetransport device.
 17. The component placement device as claimed in claim10, wherein the substrate support is configured to be moved verticallyfrom a position parallel to the transport device to a positionunderneath the transport device.
 18. The component placement device asclaimed in claim 11, wherein the substrate support is configured to bemoved vertically from a position parallel to the transport device to aposition underneath the transport device.